By John W. Evans PhD (auth.), Werner Engelmaier Dipl.-Ing. (eds.)
While tin/lead solders have ruled the electronics for a few years, environmental concerns and new laws are forcing swap. sponsored via greater than ten years of study in Pb-free solders, many electronics brands are poised for conversion.
A consultant to Lead-free Solders is meant as a device to aid because it strikes right into a new period within the construction and use of solders. an outline of the foundations of soldering know-how is supplied starting with the idea underlying each one thought. targeting the main updated equipment for trying out and characterization, those theories are then strengthened via experimental examples and business applications.
• Addresses key concerns in meeting from a fabrics element of view.
• supplies the reader handy entry to info crucial for the correct review and employment of state of the art ternary Sn/Ag/X solders
• permits comparability of the functionality of Pb-free solders with that of ordinary eutectic SnPb.
Although basically of curiosity to specialist layout and reliability engineers operating in electronics meeting and production, A consultant to Lead-free Solders can also be worthwhile for graduate scholars trying to practice services in fabrics, mechanical or digital engineering during this undefined. Researchers in electronics and fabrics will locate the most recent examine at their fingertips including the most likely instructions will want from such examine within the future.
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Extra info for A Guide to Lead-free Solders: Physical Metallurgy and Reliability
A variation is the tape or tab BGA (TBGA), based on a flexible polyimide film (tape) with copper metallization on both sides. For smaller sizes, various advanced BGA technologies or chip-scale packages (CSPs) may be employed. 5 mm. 5 shows the fine pitch and small size achieved with a CSP package. 4. 5. 5 mm pitch (Treece, mini Ball Grid Array (mBGA) Assembly on MCM-L Boards in Electronic Components and Technology Conference, © IEEE 1994. 6. The flip-chip interconnect is based on three fundamental building blocks: the bumps on the chip, the substrate and the method of joining the chip to the substrate (Boustedt 1998).
87–114. , (September 1990), “Environmental Stress Screening and Use Environments Their Impact on Surface Mount Solder Joint Reliability”. Proc. of IEPS Conference. , (1998), Unpublished communication. Evans, J. W. , (November 1990), “SMT Reliability for Space Flight”, Surface Mount Technology, Vol. , No. , pp 2431. Evans, J. , (1991) Goddard Space Flight Center Construction Analysis Report, Serial No. 93114. Evans, J. , (April 1990), “Grain Growth in Eutectic Solder: Implications for Accelerated Testing”, IPC Presentation, IPC Spring Meeting, Boston, MA.
346357. Lau, J. , and Pao, Y. Y. Manko, H. , McGraw-Hill, New York. Martin, J. , and Doherty, R. 37, pp. 173223. Mather, J. , (March 1985), “Component Attachment Reliability”, Proc. of the Fifth Capacitor and Resistor Technology Symposium, San Diego, CA. , (1997), Creep, stress relaxation, and plastic deformation in Sn-Ag and Sn-Zn eutectic solders. Journal of Elec Mat 26:783–790. , Argon, A. (eds) (1966), Mechanical Behavior of Materials, AddisonWesley, Reading, Massachusetts. , (1994) Improved mechanical properties in new, Pb-free solder alloys.